Polyimide film is condensed with 4-formic acid-2-anhydride of benzene and 4.4 -diamino-biphenyl-ether oxide. It has high low-temp resistance, radiation hardening and good Dielectric. Film surface is smooth, clean without any crease, bubble and impurity. 

With their high heat-resistance, polyimide film has diverse applications such as substrates for flexible printed circuits, transformer and capacitor insulation and bar code labels.